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Tuesday, November 28, 2017

Microwave-based test method can help keep 3-D chip designers' eyes open

http://ift.tt/eA8V8J Scientists have invented a new approach to testing the multilayered, three-dimensional computer chips that now appear in some of the latest consumer devices. The novel method may be the answer the semiconductor industry needs to quickly assess the reliability of this relatively new chip construction model.

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